Nickel Powder and Nano Copper

TRUER’s R&D team began dedicated research on nano copper and nickel powders in 2021. After years of continuous development, an independent production line for nano spherical copper, nano nickel, and flake copper powders was officially established in 2023.

Morphology of 300 nano spherical copper powder:

우리의 300 nano spherical copper powder has excellent dispersibility, high sintering activity, and well-balanced particle size distribution. Suitable as a substitute for conductive silver paste, as well as in conductive inks,  packaging copper pastes, and high-thermal-conductivity fillers.

5 micron flake copper powder:

Flake copper powder has strong surface oxidation resistance and a high aspect ratio, making it ideal for conductive silver paste alternatives in photovoltaic HJT cells and thick-film circuits.

300 nano nickel powder:

Nano nickel powder has high purity, narrow particle size distribution, excellent crystallinity, and strong oxidation resistance. Primarily used in MLCC internal electrodes, supporting the trend toward miniaturization and higher capacity in MLCC development.

In terms of particle size, morphology, distribution, tap density, and batch-to-batch consistency, TRUER R&D team has developed unique process designs that enable large-scale and highly stable production of nano- and submicron-level metal powders.